Nvidia outlines plans for using light for communication between AI GPUs by 2026 — silicon photonics and co-packaged optics may become mandatory for next-gen AI data centers


The extreme demands of passing communication between ever-growing clusters of AI GPUs is fueling a move towards using light for communication across the networking layers. Earlier this year, Nvidia outlined that its next-generation rack-scale AI platforms will use silicon photonics interconnects with co-packaged optics (CPO) for higher transfer rates at lower power. At the Hot Chips conference this year, Nvidia released some additional information about its next-generation Quantum-X and Spectrum-X photonics interconnection solutions and when they will arrive in 2026.

Nvidia’s roadmap will likely closely follow TSMC’s COUPE roadmap, which unfolds in three stages. The first generation is an optical engine for OSFP connectors, offering 1.6 Tb/s data transfer while reducing power consumption. The second generation moves into CoWoS packaging with co-packaged optics, enabling 6.4 Tb/s at the motherboard level. The third generation aims for 12.8 Tb/s within processor packages and targets further cuts in power and latency.



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